Design of a Transceiver System at C-Band based on Multi- Technology

This paper presents design and simulation of a transceiver system for active phased array at C-Band using multi-technology based chips. Multi-technology feature is new emerging technique for complex RF and microwave systems designs where transceiver chips based on different fabrication technologies like MMIC, LTCC and microstrip are integrated on same RF board. Design and simulation of full transceiver system is very challenging because of the presence of multiple technologies in one single design. Finite Element Method (FEM) based electromagnetic solver has been used to simulate complete module. A peak module output gain 18.2 dB has been achieved at an overall module efficiency of 21%. Keywords—MMIC, LTCC, Chip-in-package, MultiTechnology, Transceiver, Active phased Array Antenna, ADS